S5062X170RAU12

S5062X170RAU12
产品概述
● 1U 机架式(DC‑MHS 架构)
● 搭载 2 颗英特尔 ® 至强 ® 6500/6700 系列处理器,单颗 TDP 最高 350W
● 32 条 DDR5 RDIMM 插槽,每 CPU 8 通道(2DPC),最高速率:6400MT/s(1DPC)、5200MT/s(2DPC)
● 前置 12 个 2.5 英寸热插拔 U.2 PCIe 5.0 x4 NVMe 硬盘位
● 后置 2 个热插拔 E1.S 9.5mm PCIe 5.0 x4 NVMe 硬盘位
● 2 个 2280/22110 规格 PCIe 5.0 x2 NVMe M.2 接口
● 2 个 PCIe 5.0 x16 扩展插槽
● 1 个 PCIe 5.0 x16 OCP3 网卡夹层插槽(支持 NCSI)
● 1 个 1000Base‑T 专用服务器管理网口,具备:
● ASPEED AST2600 管理芯片,支持 IPMI 2.0 与 DMTF Redfish 规范
● 双 BIOS 与双 BMC 设计
● 支持 TPM2.0 及硬件信任根模块(可选)
产品应用
● 云计算服务
● 内容分发网络
● 网络功能虚拟化
详情介绍
规格参数
下载
Form Factor

1U
Dimensions

438.5mm(17.2") x43mm(1.7") Hx770mm(30.3")D
Processor

Dual Intel® Xeon® 6700E-series, 6500P-series and 6700P-series processors, TDP up to 350W
Socket

(2) LGA4710 (Socket E2)
Chipset

N/A
Memory
(32) DDR5 DIMM Slots, 8 channels per CPU(2DPC), RDIMM/RDIMM-3DS/MRDIMM
- Max. Frequency:
RDIMM: 6400MT/s(1DPC), 5200MT/s(2DPC)
MRDIMM: 8000MT/s(only support 1DPC)
- Max. Capacity per DIMM: 256GB(RDIMM), 64GB(MRDIMM)

*MRDIMMs are only supported with Intel® Xeon® 6 P-core series processors
Drive Bays

(12) Front hot-swap 2.5" U.2 PCIe 5.0 x4 NVMe drive bays (6 from CPU0, 6 from CPU1)
(2) Rear hot-swap E1.S 9.5mm PCIe 5.0 x4 NVMe drive bays (CPU1)
Internal Storage
(2) 2280/22110 PCIe 5.0 x2 NVMe M.2 ports (CPU0)
Expansion Slots
(2) PCIe 5.0 x16 FHHL single wide slots (1 from CPU0, 1 from CPU1)
Networking
(1) PCIe 5.0 x16 OCP3 NIC Mezzanine slot (CPU0, NCSI supported)
RAID
NVMe RAID 0/1/5/10 support (Intel® VROC RAID key required)
Front I/O

(12) Hot-swap 2.5" U.2 drive bays
(1) USB 3.0 Type-A Port
(1) USB 2.0 Type-A Port
(1) System Power LED Button
(1) UID LED Button
(1) Reset Button
(4) Status LEDs: Fault/LAN/M.2
Rear I/O

(2) Hot-swap E1.S 9.5mm drive bays
(1) 1000Base-T Dedicated Server Management Port
(1) COM USB Type A port
(1) USB 2.0 Type-A Port
(1) Mini Display port
(1) Power LED(Green) Button
(1) UID LED(Blue) Button
(1) Status LEDs: Green/Red
Security

Chassis Intrusion
TPM2.0 module supported (optional)
ASPEED AST1060 Hardware Root of Trust module supported (optional)
Server Management
(1) 1000Base-T Dedicated Server Management Port
ASPEED AST2600 with AMI MegaRAC based firmware supporting IPMI 2.0 and DMTF Redfish API
Dual BIOS and dual BMC
eMMC for local BMC storage media
Environment

System Operating Temperature: 0°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -20°C ~ 70°C (-4°F to 158°F)
Non-operating Relative Humidity: 5% to 85% (non-condensing)
Power Supply
(1+1) Redundant 2000W CRPS 80PLUS Titanium
Dimension (WxHxL): 73.5 x 40 x 185 mm

Rating:
AC Input: 100-127Vac, 15A, 47-63Hz
Output: Max 1000W, DC +12V/81.8A, +12Vsb/3A
AC Input: 200-219Vac, 10A, 47-63Hz
Output: Max 1800W, DC +12V/147A, +12Vsb/3A
AC Input: 220-240Vac, 10A, 47-63Hz
Output: Max 2000W, DC +12V/163.6A, +12Vsb/3A
DC Input: 240V, 10A
Output: Max 2000W

*C13 power cords are required and will be offered as optional accessories.
Cooling

(2) EVAC air cooling modules for max. 350W CPU
(8) 4056 Hot-swap System Fans
Certification

CE, FCC (Class A)
Package Contents

(1) Barebone
(1) Quick guide
(1) Slide rail Kit
(2) CPU Coolers
(2) CPU Carrier E2A
(2) CPU Carrier E2B
(2) CRPS PSUs(inside system)
Optional parts

TPM2.0 module: TPM20-IRS
RoT module: ROT1
Power cords:
-C13 1.8m 125V/15A(US, NEMA 5-15P): K33-3001359-I45
-C13 1.8m 250V/15A(US, NEMA 6-15P): K33-3001365-I45
-C13 1.8m 250V/16A(EU): K33-3001005-I45
-C13 1.8m 250V/10A(CN): K33-3001029-I45
-C13 1.8m 125V/13A(JP): K33-3001346-I45
-C13 to C14 1.8m 250V/15A(US): K33-3001360-I45
-C13 to C14 1.8m 250V/10A(EU): K33-3001424-I45
RAID Card Cable(Slimline SAS 8i to MCIO 8i, 800mm): K1K-3074207-V03
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文件版本 系统 更新日期 简要介绍 下载
文件版本 系统 更新日期 简要介绍 下载
文件版本 系统 更新日期 简要介绍 下载